Additive Manufacturing

MT360 BRINGS TOGETHER THE TECHNOLOGY, MANUFACTURING, AND VC COMMUNITIES

Tuesday 14 January 2020, 12:24 PM

The Association For Manufacturing Technology (AMT) today announced that its MT360 Conference will be held May 12-14, 2020 at the Santa Clara Convention Center in Santa Clara, Calif. The unique event brings together the technology, manufacturing, and VC communities to discuss and demonstrate the role of transformative technologies in the future of manufacturing.

A two-and-a-half-day immersion in the world of transformative technologies, MT360 will showcase and demonstrate the integration of additive manufacturing, augmented reality, cognitive automation, and the digital thread into manufacturing operations.

“The MT360 Conference is part of AMT’s lifecycle strategy around transformative technologies,” said Douglas Woods, president of AMT. “The Silicon Valley and manufacturing technology communities evolved separately, and there are no well-orchestrated paths in the market to bring them together. There is enormous opportunity for collaboration, learning, and investment between these communities to accelerate product development.”

MT360 features:

A Tech Theater featuring curated content from leaders across the manufacturing, technology, and investment industries showcasing the application of transformative technologies to manufacturing.
A Virtual Factory connecting the concept of transformative technologies with demonstrated applications and solutions.
16 Start Up Hubs including start-up companies and VC investors presenting on innovative technology applications and investment opportunities.
Tech Garages anchored by companies such as Cisco showcasing their connection to digital manufacturing and discussing how they see various solutions evolving.

Keynote presenters:

Mickey McManus, visiting research fellow at the Office of the CTO at Autodesk; principal and chairman of the board at MAYA Design
Rob Csongor, vice president of Autonomous Machines at NVIDIA
Douglas Ramsey, chief development officer at Hackrod

Additional presenting companies include Cisco, Oracle Corporation, Hewlett-Packard, FormLabs, EOS, Humatics, Thyssenkrupp, 3DEO, and many others.

Conference sponsors include Cisco, 3DEO Production, Digital Alloys, DM3D, ESPIRIT, Festo, Humatics, MachineMetrics, Machining Cloud, Mazak, and TechSolve. Media sponsors include Additive Manufacturing magazine and Engineering.com.

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Nakamura
Star
Okuma
Mazak
Makino
Hurco
Fanuc
Chiron
Brother
DMG Mori
Doosan
Methods
Kitamura
Starrag
Matsurra